Component-containing module

ABSTRACT

A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a component-containing module includinga core substrate and an electronic component which is mounted on thecore substrate and which is sealed with resin.

2. Description of the Related Art

In recent years, advanced compact module components have been demanded.A component-containing module having a structure in which electroniccomponents are mounted on both surfaces of a core substrate and theelectronic components located on the mounting surface side thereof areembedded in resin has been used. In such a component-containing module,electronic components mounted on the mounting surface side of a coresubstrate are embedded in resin and, therefore, a flat mounting surfacecan be provided. A known example of the component-containing module is ahigh-frequency semiconductor device disclosed in Japanese Patent No.3890947.

With reference to FIG. 8, the high-frequency semiconductor device, whichis disclosed in Japanese Patent No. 3890947, includes a ceramicsubstrate 2, a circuit pattern which is disposed under the lower surfaceof the ceramic substrate 2 and which includes integrated circuitelements 1 a, 1 b, and 1 c and passive elements (not shown), and acomposite resin material layer 10 which covers the lower surface of theceramic substrate and in which the integrated circuit elements 1 a, 1 b,and 1 c and the passive elements are embedded. The composite resinmaterial layer 10 has a flat lower surface. The lower surface of thecomposite resin material layer 10 has a plurality of external connectionelectrodes 4 disposed thereon. The composite resin material layer 10includes via-holes 11. The via-holes 11 are filled with a conductiveresin 12. The external connection electrodes 4, which are arranged onthe composite resin material layer 10, are electrically connected to thecircuit pattern, which covers the lower surface of the ceramic substrate2, through the conductive resin 12. The upper surface of the ceramicsubstrate 2 includes a chip component 3, such as a chip capacitor,disposed thereon for finely tuning the high-frequency circuit constant.The ceramic substrate 2 includes passive elements, such as printingresistors 8 and printing capacitors 9 arranged therein. The integratedcircuit elements 1 a, 1 b, and 1 c are a gallium arsenide powersemiconductor element 1 a, a gallium arsenide semiconductor element 1 bdefining a switching element, and a silicon semiconductor element 1 cfor circuit control.

In the high-frequency semiconductor device (component-containingmodule), which is disclosed in Japanese Patent No. 3890947, thethickness of the ceramic substrate 2 substantially depends on the numberof interconnection layers included in the circuit pattern because of thestructure thereof. Therefore, an increase in the number of terminals ofthe integrated circuit elements 1 a, 1 b, and 1 c, which are mounted onthe ceramic substrate 2, increases the thickness of the ceramicsubstrate 2. Furthermore, the arrangement of the passive elements, theelectron injection layer 8, and the cathode 9 in the ceramic substrate 2increases the number of interconnection layers, which increases thethickness of the ceramic substrate 2. Therefore, there is a problem inthat the size of the component-containing module is prevented from beingreduced when the integrated circuit elements 1 a, 1 b, and 1 c and thepassive elements are densely arranged.

SUMMARY OF THE INVENTION

To prevent the problems described above, preferred embodiments of thepresent invention provide a component-containing module which includeselectronic components, such as integrated circuit elements and passiveelements, that are densely mounted on a substrate and which can bereduced in profile and size.

A component-containing module according to a preferred embodiment of thepresent invention includes a core substrate which includes a firstprincipal surface and a second principal surface facing the firstprincipal surface, said first principal surface including recessedportions and a raised portion, and the core substrate including aplurality of interconnection layers, an integrated circuit elementarranged at a location which is above the second principal surface andwhich corresponds to the raised portion, passive elements disposed inthe recessed portions of the first principal surface, a resin layerwhich overlies at least one of the first and second principal surfacesand which has a flat surface, and an electrode which is disposed on theflat surface of the resin layer and which is electrically connected tothe interconnection layers.

In the component-containing module, the core substrate is preferablymade of ceramic.

In the component-containing module, the resin layer preferably overliesthe first principal surface and covers the raised portion.

The component-containing module preferably further includes a via-holeconductor connecting a convex surface of the raised portion to theelectrode disposed on the flat surface of the resin layer.

The component-containing module preferably further includes a high heatconductor disposed in a portion of the resin layer that covers theconvex surface of the raised portion.

In the component-containing module, the raised portion is preferablydisposed at substantially the center of the first principal surface ofthe core substrate in a specific sectional view including the raisedportion, the recessed portions are preferably arranged on both sides ofthe raised portion, and the passive elements are preferably separatelydisposed in the recessed portions.

In the component-containing module, the resin layer is preferablydisposed on both the first and second principal surfaces.

The component-containing module preferably further includes a shieldinglayer disposed on the resin layer that is different from the resin layeron which the electrode is disposed and that is among the two resinlayers formed on the first and second principal surfaces.

Thus, preferred embodiments of the present invention provide acomponent-containing module in which electronic components, such asintegrated circuit elements and passive elements, are densely arrangedand which can be reduced in profile and size.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a component-containing module according toa first preferred embodiment of the present invention.

FIG. 2 is a sectional view of a modification of the component-containingmodule shown in FIG. 1.

FIG. 3 is an illustration showing a step of a method for manufacturing acore substrate included in the component-containing module shown in FIG.1.

FIG. 4 is a perspective view of the core substrate formed through thestep shown in FIG. 3.

FIG. 5 is a sectional view of a component-containing module according toa second preferred embodiment of the present invention and correspondsto FIG. 1.

FIG. 6 is a sectional view of a component-containing module according toa third preferred embodiment of the present invention and corresponds toFIG. 1.

FIG. 7 is a sectional view of a component-containing module according toa fourth preferred embodiment of the present invention and correspondsto FIG. 1.

FIG. 8 is a sectional view of an example of a conventionalcomponent-containing module.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will now be describedwith reference to FIGS. 1 to 7. FIG. 1 is a sectional view of acomponent-containing module according to a preferred embodiment of thepresent invention. FIG. 2 is a sectional view of a modification of thecomponent-containing module shown in FIG. 1. FIG. 3 is an illustrationshowing a step of a method for manufacturing a core substrate includedin the component-containing module shown in FIG. 1. FIG. 4 is aperspective view of the core substrate formed through the step shown inFIG. 3. FIGS. 5 to 7 are sectional views of component-containing modulesaccording to other preferred embodiments of the present invention andcorrespond to FIG. 1.

First Preferred Embodiment

A component-containing module 10 of this preferred embodiment includes acore substrate 11 including a plurality of stacked ceramic layers 11A asshown in FIG. 1. The core substrate 11 includes a first principalsurface (lower surface) 11B including a raised portion 11C and recessedportions 11D. The raised portion 11C is located at substantially thecenter of the lower surface 11B of the core substrate 11. The recessedportions 11D are arranged on the right and left of the raised portion11C. The core substrate 11 includes a second principal surface (uppersurface) 11E which faces the lower surface 11B and which is a flat orsubstantially flat surface having no irregularities. The recessedportions 11D and 11D, which are located on the right and left of theraised portion 11C, have the same or substantially the same depth. Theceramic layers 11A are arranged in the raised portion 11C and therecessed portions 11D and include predetermined circuit patterns 12. Thecircuit patterns 12 include interconnection layers (hereinafter referredto as “in-plane conductors”) 12A which are each located at the interfacebetween the upper and lower ceramic layers 11A and which have apredetermined pattern, via-hole conductors 12B which electricallyconnect the upper and lower in-plane conductors 12A and 12A to eachother and which have a predetermined pattern, and surface electrodes 12Cwhich are arranged on the lower surface 11B and upper surface 11E of thecore substrate 11 and which have a predetermined pattern.

An integrated circuit element 13, such as a gallium arsenidesemiconductor element or a silicon semiconductor element, is arranged ata location which is above the upper surface 11E of the core substrate 11and which corresponds to the raised portion 11C as shown in FIG. 1. Theintegrated circuit element 13 is electrically connected to the surfaceelectrodes 12C through a plurality of external terminal electrodes 13Aby soldering. The raised portion 11C of the lower surface 11B of thecore substrate 11 and the integrated circuit element 13, which ismounted above the upper surface 11E, overlap in plan view. Many of thecircuit patterns 12 that are associated with the integrated circuitelement 13 are centered in the raised portion 11C. To increase thenumber of the external terminal electrodes 13A under the integratedcircuit element 13, the number of the in-plane conductors 12A arrangedin the raised portion 11C is increased and the in-plane conductors 12Aare electrically connected to the surface electrodes 12C through thevia-hole conductors 12B. This can accommodate the increase in the numberof the external terminal electrodes 13A under the integrated circuitelement 13. All of the external terminal electrodes 13A under theintegrated circuit element 13 are preferably in an area defined byprojecting the raised portion 11C onto the upper surface 11E of the coresubstrate 11. Junctions between the core substrate 11 and the externalterminal electrodes 13A are likely to cause cracks in the core substrate11. However, cracks are not caused therein because all of the externalterminal electrodes 13A are in the projected area of the raised portion11C and a portion of the core substrate 11 that is bonded to theexternal terminal electrodes 13A is relatively thick.

A first passive element 14A and second passive element 14B, such as achip capacitor or a chip inductor, are disposed in the right and leftrecessed portions 11D and 11D of the core substrate 11 as shown inFIG. 1. The first and second passive elements 14A and 14B includeexternal terminal electrodes and are electrically connected to thesurface electrodes 12C through the external terminal electrodes thereof.The first and second passive elements 14A and 14B which are disposed inthe recessed portions 11D preferably have a height less than that of theraised portion 11C, that is, a height not greater than that of theraised portion 11C. When the first and second passive elements 14A and14B have a height less than that of the raised portion 11C, the heightof the first and second passive elements 14A and 14B is less than theheight of the core substrate 11. This allows the component-containingmodule 10 to have low profile.

A resin layer 15 (a composite resin layer preferably made of, forexample, an organic resin material including an inorganic powdercomponent) underlies the lower surface 11B of the core substrate 11. Theraised portion 11C is entirely covered with the composite resin layer 15and the first and second passive elements 14A and 14B are disposed inthe recessed portions 11D and are sealed with the composite resin layer15. The composite resin layer 15 has a flat or substantially flat lowersurface. The composite resin layer 15 has a thin portion disposed underthe lower surface 11B of the raised portion 11C and thick portions whichare disposed under the lower surfaces 11B of the recessed portions 11Dand which seal the first and second passive elements 14A and 14B. Thus,the lower surface thereof is flat or substantially flat. The recessedportions 11D of the core substrate 11 have an enhanced mechanicalstrength due to the composite resin layer 15.

A peripheral portion of the lower surface of the composite resin layer15 includes a plurality of external terminal electrodes 16 arranged in apredetermined pattern. The external terminal electrodes 16 are arrangedopposite to the surface electrodes 12C, which are arranged in therecessed portions 11D in a predetermined pattern, and are electricallyconnected to the circuit patterns 12 through via-hole conductorsdisposed in the composite resin layer 15. The via-hole conductors 17 areformed such that tapered via-holes are formed in the composite resinlayer 15 using, for example, a laser beam and are then filled with aconductive resin. The external terminal electrodes 16 are used toelectrically connect the component-containing module 10 to surfaceelectrodes of a mounting board, such as a mother board, for example.

The integrated circuit element 13 is located at a position which isabove the upper surface 11E and which corresponds to the raised portion11C corresponding to the raised portion 11C as described above. Theraised portion 11C includes the ceramic layers 11A, which have good heatconductivity. Thus, even if the integrated circuit element 13 generatesheat, the heat generated therefrom is readily transferred to the lowersurface 11B through the raised portion 11C and, therefore, can beefficiently dissipated from the lower surface 11B of the raised portion11C. The recessed portions 11D of the core substrate 11 are mechanicallyreinforced with the composite resin layer 15 and, therefore, have goodresistance to impact due to falling.

In this preferred embodiment, as shown in FIG. 1, the lower surface 11Bof the core substrate 11 is covered with the composite resin layer 15such that the raised portion 11C and the first and second passiveelements 14A and 14B are embedded in the composite resin layer 15 asdescribed above. As shown in FIG. 2, the integrated circuit element 13may preferably be embedded in the composite resin layer 15 by coveringthe upper surface 11E of the core substrate 11 with the composite resinlayer 15 and the raised portion 11C of the lower surface 11B of the coresubstrate 11 and the first and second passive elements 14A and 14B maybe exposed. In this configuration, a low-profile compact module similarto the component-containing module 10 shown in FIG. 1 can be obtainedbecause the circuit patterns 12 associated with the integrated circuitelement 13 can be centered in the raised portion 11C and the first andsecond passive elements 14A and 14B, which are located on the right andleft of the raised portion 11C, are disposed in the recessed portions11D. The mechanical strength of the recessed portions 11D can beimproved with the composite resin layer 15. Substantially the sameadvantages as those of the component-containing module 10 shown in FIG.1 can be achieved.

In this preferred embodiment, the core substrate 11 preferably includesthe ceramic layers 11A as described above. The core substrate 11 is notlimited to the ceramic layer. The core substrate 11 may preferably beformed by stacking resin layers made of, for example, a heat-curableresin.

When the core substrate 11 includes a ceramic layer, for example, a lowtemperature co-fired ceramic (LTCC) material can be used as a materialfor the ceramic layers 11A. The low temperature co-fired ceramicmaterial is a type of ceramic material which is sinterable at atemperature of about 1050° C. or less and which can be co-fired withsilver or copper, which has low resistivity. Examples of the lowtemperature co-fired ceramic material include a composite glass LTCCmaterial prepared from a mixture of borosilicate glass and a ceramicpowder, such as an alumina powder, a zirconia powder, a magnesia powder,or a forsterite powder; a crystalline glass LTCC material prepared fromZnO—MgO—Al₂O₃—SiO₂ crystalline glass; and a non-glass LTCC materialprepared from a BaO—Al₂O₃—SiO₂ ceramic powder, anAl₂O₃—CaO—SiO₂—MgO—B₂O₃ ceramic powder, and/or another ceramic powder.When the ceramic layers 11A are made of the low temperature co-firedceramic material, a metal, such as silver or copper, having lowresistivity and a low melting point can be used to form the circuitpatterns 12 and the core substrate 11 and the circuit patterns 12 can beformed at a temperature of about 1050° C. or less by co-firing.

Alternatively, a high temperature co-fired ceramic (HTCC) material canbe used as a material for the ceramic layers 11A. The high temperatureco-fired ceramic material is preferably one prepared by sintering amixture of alumina, aluminum nitride, mullite, a sintering aid such asglass, and another material at about 1100° C. or greater. In this case,a metal material selected from the group consisting of molybdenum,platinum, palladium, tungsten, nickel, and alloys containing thesemetals, for example, can be used to form the circuit patterns 12.

A method for manufacturing the component-containing module 10 shown inFIG. 1 is schematically described below. The component-containing module10 is manufactured such that a plurality of component-containing modules10 are simultaneously prepared and are then separated from one another.As shown in FIG. 3, for example, a predetermined number of first ceramicgreen sheets 111A having a size corresponding to that of thecomponent-containing modules 10 are prepared. Via-holes (not shown) areformed in the first ceramic green sheets 111A in a predetermined patternand are then filled with, for example, a conductive paste. In-planeconductive portions (not shown) having a predetermined pattern are eachformed on the upper surface of a corresponding one of the first ceramicgreen sheets 111A by screen printing.

In order to form the raised portion 11C and the recessed portions 11D onthe lower surface 11B of each component-containing module 10, apredetermined number of second ceramic green sheets 111′A having stampedout portions 111′D arranged in a matrix pattern are prepared such thatthe first ceramic green sheets 111A are stamped with a rectangular dieas shown in FIG. 3. In-plane conductive portions and via-hole conductorsare formed on the upper surfaces of the second ceramic green sheets111′A as well as on the first ceramic green sheets 111A.

After a predetermined number of the first ceramic green sheets 111A arestacked, a predetermined number of the second ceramic green sheets 111′Aare stacked thereon, whereby a ceramic green sheet laminate 111 isobtained. The upper surface of the ceramic green sheet laminate 111 hasa raised portion 111C and recessed portions 111D. The ceramic greensheet laminate 111 is sintered by firing the ceramic green sheetlaminate 111 at a predetermined temperature, whereby a mother substrateis obtained.

After the first and second passive elements 14A and 14B are mounted inthe recessed portions 111D of the mother substrate, a prepreg ishot-pressed against the recessed portion side of the mother substrate,whereby the first and second passive elements 14A and 14B are embeddedin the recessed portions thereof. The prepreg is heat-cured, whereby thecomposite resin layer 15 is formed. Via-holes are formed in thecomposite resin layer 15 in a predetermined pattern and are then filledwith a conductive resin, whereby the via-hole conductors 17 are formed.The external terminal electrodes 16 are formed on a surface of thecomposite resin layer 15 by a lithographic or etching technique, forexample. The mother substrate is turned over and the integrated circuitelement 13 is mounted on a flat surface of the mother substrate thatdoes not include recessed portions. In this operation, the raisedportion 11C and the integrated circuit element 13 are arranged so as tooverlap with each other in plan view. The mother substrate is dividedinto pieces, whereby the component-containing module 10 according tothis preferred embodiment is obtained.

In this preferred embodiment, the raised portion 11C and recessedportions 11D of the component-containing module 10 are simultaneouslyformed using the second ceramic green sheets 111′A having the stampedout portions 111′D as described above. A mother substrate for formingthe core substrate 11 used in this preferred embodiment may be formedsuch that a tabular first ceramic laminate and block-shaped secondceramic laminates are prepared in advance, the second ceramic laminatesare disposed on the first ceramic laminate, and the first and secondceramic laminates are bonded together.

According to this preferred embodiment, the component-containing module10 has the lower surface 11B, which includes the raised portion 11C andrecessed portions 11D, and the upper surface 11E, which faces the lowersurface 11B, as described above. The component-containing module 10includes the in-plane conductors 12A, which are arranged at theinterface between the ceramic layers 11A and which have a predeterminedpattern, the integrated circuit element 13, which is arranged at thelocation that is above the upper surface 11E and that corresponds to theraised portion 11C corresponding to the raised portion 11C, the firstand second passive elements 14A and 14B, which are disposed in therecessed portions 11D of the lower surface 11B, the composite resinlayer 15, which is disposed under the lower surface 11B and has the flator substantially flat surface, and the external terminal electrodes 16,which are arranged on the flat surface of the composite resin layer 15and are electrically connected to the surface electrodes 12C. Theintegrated circuit element 13 is disposed so as to overlap with theraised portion 11C in plan view. Therefore, even if the number of theterminal electrodes 13A under the integrated circuit element 13 isincreased, the circuit patterns 12 can be arranged in the raised portion11C without increasing the number of the ceramic layers 11A. The heightof the first and second passive elements 14A and 14B, which are disposedin the recessed portions 11D, is less than that of the core substrate11. This allows the component-containing module 10 to have low profileand a compact size. The number of the first and second passive elements14A and 14B can be increased such that the recessed portions 11D areformed over a wide area by providing the raised portion 11C only at anecessary location. This advantage can be achieved when the first andsecond passive elements 14A and 14B are taller than the raised portion11C.

According to this preferred embodiment, the core substrate 11 includesthe ceramic layers 11A. Thus, even if the integrated circuit element 13generates heat, the heat generated therefrom is readily transferred tothe lower surface 11B through the ceramic layers 11A, which has goodheat conductivity and is disposed in the raised portion 11C, and,therefore, can be efficiently dissipated from the lower surface 11B.This enables the component-containing module 10 to have increasedcooling efficiency. Since the first and second passive elements 14A and14B are separately arranged on both sides of the raised portion 11C, thefirst and second passive elements 14A and 14B separated from one anotherand, therefore, the electromagnetic interference therebetween can besignificantly reduced. This enables the component-containing module 10to have increased reliability.

Second Preferred Embodiment

FIG. 5 shows a component-containing module 10A of this preferredembodiment. The component-containing module 10A has a configurationsubstantially the same as that of the component-containing module 10 ofthe first preferred embodiment, except that the lower surface 11B of acore substrate 11 includes a second raised portion 11C₁, a plurality ofsmall via-hole conductors 17A are arranged in portions of a compositeresin layer 15 that cover a corresponding one of the lower surface 11Bof the raised portion 11C and the lower surface 11B of the second raisedportion 11C₁, and a third passive element 14C and a fourth passiveelement 14D are arranged on the upper surface 11E of the core substrate11 so as to be adjacent to an integrated circuit element 13. In thispreferred embodiment, the same components as those described in thefirst preferred embodiment or components corresponding to thosedescribed in the first preferred embodiment are denoted by the samereference numerals as those used in the first preferred embodiment. Theprincipal features of this preferred embodiment are described below. Inthis preferred embodiment, a raised portion 11C located at theapproximate center of the core substrate 11 is referred to as a firstraised portion 11C.

In this preferred embodiment, the lower surface 11B of the coresubstrate 11 includes the first and second raised portions 11C and 11C₁and two recessed portions 11D and 11D as shown in FIG. 5, the first andsecond raised portions 11C and 11C₁ and the recessed portions 11D beingalternately arranged. The first and second raised portions 11C and 11C₁preferably have substantially the same height. The two recessed portions11D and 11D preferably have substantially the same depth. A firstpassive element 14A and second passive element 14B are each disposed ina corresponding one of the two recessed portions 11D. The lower surface11B of the core substrate 11 is entirely covered with the compositeresin layer 15. The first and second passive elements 14A and 14B, whichare disposed in the two recessed portions 11D and 11D, are covered andsealed with the composite resin layer 15. The lower surface of thecomposite resin layer 15 is flat or substantially flat. The raisedportion 11C is arranged at a location at which a large number ofin-plane conductors 12A are required because of the increase of thenumber of terminals under the integrated circuit element 13 as shown inFIG. 5. The second raised portion 11C₁ is arranged at, for example, alocation at which the heat generated from the third passive element 14C,such as a resistor, must be dissipated.

The small via-hole conductors 17A are arranged in the portions of thecomposite resin layer 15 that cover the first and second raised portions11C and 11C₁. The via-hole conductors 17 form a predetermined pattern.The small via-hole conductors 17A electrically connect surfaceelectrodes 12C disposed under the lower surfaces 11B of the first andsecond raised portions 11C and 11C₁ to external terminal electrodes 16disposed under the lower surface of the composite resin layer 15. Thesmall via-hole conductors 17A are defined by via-holes formed using alaser beam that are filled with a conductive paste. The via-holes, whichare formed using the laser beam, have openings in the composite resinlayer 15 and preferably have a tapered shape such that the via-holes aregradually reduced in diameter from the openings toward the lowersurfaces 11B of the first and second raised portions 11C and 11C₁. Thereis preferably substantially no difference in diameter between theopenings of the small via-holes and portions of the small via-holes thatare disposed under the lower surfaces of the first and second raisedportions 11C and 11C₁ because the small via-holes are formed in thinportions of the composite resin layer 15. Therefore, portions of thesmall via-hole conductors 17A that are disposed under the lower surfacesof the first and second raised portions 11C and 11C₁ have an areasubstantially equal to that of portions of the small via-hole conductors17A that are disposed in the lower surface of the composite resin layer15.

The small via-hole conductors 17A are preferably used asinterconnections for signal transmission or thermal conductors for heatdissipation in some cases. In the case of using the small via-holeconductors 17A only for heat dissipation, the small via-hole conductors17A may preferably be directly connected to ceramic layers 11A includedin the second raised portion 11C₁.

In the case of using the small via-hole conductors 17A asinterconnections for signal transmission, the outer diameter of thesmall via-hole conductors 17A may be reduced in accordance with areduction in size of the surface electrodes 12C under the lower surfaces11B of the first and second raised portions 11C and 11C₁ and externalterminal electrodes 16A under the lower surface of the composite resinlayer 15. This enables the high density interconnection of thecomponent-containing module 10A and enables the component-containingmodule 10A to have a smaller size.

In the case of using the small via-hole conductors 17A as thermalconductors for heat dissipation, heat can be efficiently dissipated fromheat-dissipating electrodes outside such that a large number of thesmall via-hole inductors 17A are provided in the composite resin layer15 and the heat dissipation areas of the first and second raisedportions 11C and 11C₁ are maintained to the lower surface of thecomposite resin layer 15 and properties of the component-containingmodule 10A can be prevented from being deteriorated such that heat isinhibited or prevented from being transferred to the first and secondpassive elements 14A and 14B in the composite resin layer 15. Inparticular, when the portions of the composite resin layer 15 that coverthe first and second raised portions 11C and 11C₁ have a relativelysmall thickness, the areas of the small via-hole conductors 17A underthe lower surfaces 11B thereof can be maintained to the lower surface ofthe composite resin layer 15, whereby increased heat dissipationefficiency can be achieved.

According to this preferred embodiment, the small via-hole conductors17A are arranged in the portions of the composite resin layer 15 thatcover the first and second raised portions 11C and 11C₁. Therefore, evenif the circuit patterns 12 are densely arranged in the first and secondraised portions 11C and 11C₁ in response to the number of the terminalsunder the integrated circuit element 13 disposed above the raisedportion 11C, the external terminal electrodes 16A under the lowersurface of the composite resin layer 15 can be densely arranged suchthat the small via-hole conductors 17A are reduced in outer diameter.Furthermore, heat dissipation efficiency can be increased such that thenumber of the small via-hole conductors 17A is increased in accordancewith a heat source (third passive element 14C) disposed above the secondraised portion 11C₁ and heat transfer paths are provided such that theheat dissipation area of the second raised portion 11C₁ is maintained tothe lower surface of the composite resin layer 15. In this preferredembodiment, the first and second raised portions 11C and 11C₁ and thefirst and second recessed portions 11D and 11D have substantially thesame height and depths. Even if these portions have different heights ordepths, substantially the same advantages as those described above canbe achieved.

Third Preferred Embodiment

FIG. 6 shows a component-containing module 10B of this preferredembodiment. The component-containing module 10B has a configurationsubstantially the same as that of the component-containing module 10A ofthe second preferred embodiment, except that a high heat conductor 17Bis arranged so as to cover the lower surface 11B of a raised portion11C. In this preferred embodiment, the same components as thosedescribed in the second preferred embodiment or components correspondingto those described in the second preferred embodiment are denoted by thesame reference numerals as those used in the second preferredembodiment. Principal features of this preferred embodiment aredescribed below.

In this preferred embodiment, as shown in FIG. 6, the raised portion 11Cis included in a core substrate 11, a portion of a composite resin layer15 that covers the lower surface 11B of the raised portion 11C isentirely removed, and the high heat conductor 17B extends over the lowersurface 11B of the raised portion 11C. The high heat conductor 17B ispreferably made of a material (such as copper or a copper alloy) havinghigh heat conductivity. The composite resin layer 15 and the high heatconductor 17B are preferably flush or substantially flush with eachother and define a flat surface. According to this preferred embodiment,the high heat conductor 17B is disposed under the lower surface 11B ofthe high heat conductor 17B and, therefore, the heat dissipationefficiency of the raised portion 11C is increased. Even if theintegrated circuit element 13 generates a large amount of heat, the heatgenerated therefrom is efficiently dissipated from the raised portion11C and the high heat conductor 17B outside. Thus, the temperature ofthe integrated circuit element 13 can be prevented from being increasedand the temperature of a first passive element 14A and that of a secondpassive element 14B can also be prevented from being increased. This iseffective to prevent properties of the component-containing module 10from being deteriorated. According to this preferred embodiment,substantially the same advantages as those described in the secondpreferred embodiment can be achieved.

Fourth Preferred Embodiment

FIG. 7 shows a component-containing module 10C of this preferredembodiment. The component-containing module 10B has a configurationsubstantially the same as that of the component-containing module 10A ofthe second preferred embodiment, except that a integrated circuitelement 13, a third passive element 14C, and a fourth passive element14D are embedded in a composite resin layer 15A and the composite resinlayer 15A preferably has a flat or substantially flat upper surfacecovered with a shielding electrode 18 disposed thereon. In thispreferred embodiment, the same components as those described in thesecond preferred embodiment or components corresponding to thosedescribed in the second preferred embodiment are denoted by the samereference numerals as those used in the second preferred embodiment.Principal features of this preferred embodiment are described below.

In this preferred embodiment, as shown in FIG. 7, the shieldingelectrode 18 is electrically connected to a surface electrode (groundelectrode) 12C by a via-hole conductor 17C extending through thecomposite resin layer 15A, the surface electrode 12C being disposed onthe upper surface 11E of a core substrate 11. The via-hole conductor 17Ccan be formed in the same or substantially the same manner as thatdescribed in the first preferred embodiment. In this preferredembodiment, small via-hole conductors 17A are disposed in a portion of acomposite resin layer 15 that covers the lower surface 11B of a raisedportion 11C and a fifth passive element 14E that is preferably alow-profile component is disposed in a sub-portion of the lower surface11B-covering portion of the composite resin layer 15. The fifth passiveelement 14E preferably has a mounting height less than that of a firstpassive element 14A and a second passive element 14B. This is effectiveto increase the packaging density of electronic components. Theshielding electrode 18 and the composite resin layer 15 can be formedsuch that after, for example, a prepreg having a surface covered with asheet of copper is hot-pressed against the upper surface 11E of the coresubstrate 11 such that the copper sheet is directed upward, the prepregis heat-cured, the integrated circuit element 13 and the third andfourth passive elements 14C and 14D being disposed on the upper surface11E of the core substrate 11. Alternatively, the shielding electrode 18can be formed such that after the prepreg is hot-pressed against theupper surface 11E of the core substrate 11 and is then heat-cured, theupper surface of the composite resin layer 15A is plated or is coatedwith a conductive paste, the integrated circuit element 13 and the thirdand fourth passive elements 14C and 14D being disposed on the uppersurface 11E of the core substrate 11.

According to this preferred embodiment, the integrated circuit element13 and the third and fourth passive elements 14C and 14D, which aredisposed on the upper surface 11E of the core substrate 11, are sealedin the composite resin layer 15A, whereby the integrated circuit element13 and the third and fourth passive elements 14C and 14D can beprotected from external temperatures and/or humid environments, forexample. Furthermore, the upper surface of the composite resin layer 15Ais covered with the shielding electrode 18 and the shielding electrode18 is electrically connected to the ground electrode 12C, which isdisposed on the upper surface 11E of the core substrate 11, through thevia-hole conductor 17C, whereby the integrated circuit element 13 andthe third and fourth passive elements 14C and 14D can be protected fromexternal electromagnetic waves. The fifth passive element 14E, which isa low-profile component, is disposed under the lower surface 11B of theraised portion 11C. This effectively increases the packaging density ofelectronic components. The composite resin layers 15 and 15A arearranged on both surfaces of the core substrate 11. This effectivelyincreases the mechanical strength of the component-containing module10C. According to this preferred embodiment, substantially the sameadvantages as those described in the second preferred embodiment can beachieved in addition to the above-described advantages.

The present invention is not limited to the preferred embodimentsdescribed. Elements of the present invention may be modified asrequired. The core substrate described in each preferred embodiment ismade of ceramic. However, the core substrate may be made of resin. Thisis advantageous in that the core substrate is unlikely to be warped orcracked due to a change in temperature.

Preferred embodiments of the present invention provide acomponent-containing module suitable for use in various electronicdevices, such as mobile communication devices.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing the scope andspirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A component-containing module comprising: a coresubstrate including a first principal surface and a second principalsurface facing the first principal surface, said first principal surfaceincluding recessed portions and a raised portion, said core substrateincluding a plurality of interconnection layers; an integrated circuitelement arranged at a location which is above the second principalsurface and which corresponds to the raised portion; passive elementsdisposed in the recessed portions of the first principal surface; aresin layer overlying at least one of the first and second principalsurfaces and which includes a substantially flat surface; and anelectrode disposed on the substantially flat surface of the resin layerand being electrically connected to the interconnection layers.
 2. Thecomponent-containing module according to claim 1, wherein the coresubstrate is made of ceramic.
 3. The component-containing moduleaccording to claim 1, wherein the resin layer overlies the firstprincipal surface and covers the raised portion.
 4. Thecomponent-containing module according to claim 1, further comprising avia-hole conductor connecting a convex surface of the raised portion tothe electrode disposed on the substantially flat surface of the resinlayer.
 5. The component-containing module according to claim 3, furthercomprising a high heat conductor disposed in a portion of the resinlayer that covers the convex surface of the raised portion.
 6. Thecomponent-containing module according to claim 1, wherein the raisedportion is disposed at substantially a center of the first principalsurface of the core substrate, the recessed portions are arranged onboth sides of the raised portion, and the passive elements areseparately disposed in the recessed portions.
 7. Thecomponent-containing module according to claim 1, wherein the resinlayer is provided on both of the first and second principal surfaces. 8.The component-containing module according to claim 7, further comprisinga shielding layer disposed on the resin layer provided on one of thefirst and second principal surfaces that is different from the resinlayer provided on the at least one of the first and second principalsurfaces on which the electrode is disposed.